| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat dissipation without increasing the air volume of cooling air. SOLUTION: A sheet 130 having a high thermal conductivity and elasticity is inserted between dust-proof glass 112 (liquid crystal panel 92) and a hook 113, and the dust-proof glass 112 and the hook 113 are brought into close contact with the sheet 130. An air layer between the dust-proof glass 112 and the hook 113 is thereby eliminated, and thermal conductivity from the liquid crystal panel 92 to the hook 113 is improved with the high thermal conductivity of the sheet 130 to enhance the heat dissipation of a liquid crystal module 115.
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