| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive adhesive which is repairable, has good bonding strength and can achieve low resistance connection. SOLUTION: The conductive adhesive comprises a thermoset resin, a curing agent, a thermoplastic resin, a coupling agent, and an indium filler. The adhesive preferably, further comprises a particulate or a scaly silver filler. It is preferable that the coupling agent is a silicone series coupling agent, a curing accelerator is a modified imidazole compound in which a hydrogen atom of an imino group is substituted with an atomic group having an epoxy group, and the thermoplastic resin is a polymethyl methacrylate.
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