| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing not containing a halogen-based flame retardant and an antimony compound and excellent in moldability, flame retardance, high-temperature storage property, reliability to moisture resistance and crack resistance to soldering. SOLUTION: This epoxy resin composition for semiconductor sealing consists essentially of (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound having <=50 ppm total content of phosphate ion and phosphite ion contained therein and as necessary further comprises a flame-retardant auxiliary and an ion scavenger. |
