发明名称 RESIN COMPOSITION FOR PACKING AND METHOD FOR MANUFACTURING LID WITH PACKING
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for a packing having a smooth surface with little unevenness to exhibit excellent sealing properties, safe, not environment-polluting and excellent in oil resistance, and a method for manufacturing a lid with a packing. SOLUTION: The resin composition for a packing comprises 100 pts.mass of a blend of ethylene/vinyl acetate copolymers comprising (A) 40-60 mass% of an ethylene/vinyl acetate copolymer having a melt index of 1,500-2,500 g/10 min and an amount of copolymerized vinyl acetate of 10-20%, (B) 10-30 mass% of an ethylene/vinyl acetate copolymer having a melt index of 10-30 g/10 min and an amount of copolymerized vinyl acetate of 5-20%, and (C) 10-50 mass% of an ethylene/vinyl acetate copolymer having a number-average molecular weight of 2,000-3,500 and an amount of copolymerized vinyl acetate of 5-20%, and, incorporated therewith, an organic peroxide and a blowing agent. The resin composition for a packing is molten with heat to give a molten matter, which is poured into a ditch of a lid and then heated to integrally form a packing composed of a foam in the ditch.
申请公布号 JP2003147111(A) 申请公布日期 2003.05.21
申请号 JP20010350914 申请日期 2001.11.16
申请人 MITSUBOSHI BELTING LTD 发明人 KAKEHI MASANORI;TAGAWA TAKAYUKI;TAKAI HIROKAZU;KAYAMA NAOTO
分类号 B65D53/02;B29C39/10;B29K55/00;B29K105/04;B29L31/26;C08J9/04;C08K5/14;C08L23/08;F16J15/10;(IPC1-7):C08J9/04 主分类号 B65D53/02
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