发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR-INSPECTING APPARATUS AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor-inspecting apparatus for preventing a probe from being damaged in handling by retaining a probe surface where the probe is formed. SOLUTION: When the probe 4 is to be formed, a probe protection projection 5 whose tip area is larger than that of the tip in the probe 4 is also formed. Additionally, in a positioning groove formation process for forming a positioning groove, the probe protection projection 5 is removed.
申请公布号 JP2003149270(A) 申请公布日期 2003.05.21
申请号 JP20010346899 申请日期 2001.11.13
申请人 HITACHI LTD;HITACHI TOKYO ELECTRONICS CO LTD 发明人 FUJIKI NAOTO;KAWAKAMI KENJI
分类号 G01R1/073;H01L21/66;(IPC1-7):G01R1/073 主分类号 G01R1/073
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