| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering target which ensures efficient sputtering by suppressing peeling of the target during sputtering and a sputtering target with a backing plate. SOLUTION: This sputtering target is a sputtering target consisting of metal or alloy and is formed by grooving the bonding surface of the target. The depth of the grooves formed on the bonding surface of the target by the grooving ranges preferably from 0.2 to 1.0 mm, the width from 0.5 to 20 mm and the center pitch from 10 to 200 mm. As a result, a stable electric discharge can be assured and the sputtering down to the depth of the target excluding the thickness of the grooved sections is possible.
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