| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive resin paste composition which, though prepared by using low-cost copper as the main component, is excellent in migration properties, adhesive strength, and workability. SOLUTION: This adhesive resin paste composition comprises (1) an epoxy resin, (2) a curing agent, and (3) a conductive filler essentially containing a copper or copper alloy powder. The copper or copper alloy powder is a spherical or almost spherical silver-covered one of which most of the surface is covered with silver, a part of the surface being exposed. The powder has at least one of the following characteristics: (a) the content of silver is 5-25 wt.%; (b) the specific gravity is 8.99-9.31; and (c) the exposed surface area of copper or copper alloy is 10-60%. A semiconductor element is bonded to a substrate with the paste composition and sealed, giving a semiconductor device.
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