| 摘要 |
PROBLEM TO BE SOLVED: To obtain a conductive adhesive having thermal resistance at 200-300 deg.C, excellent in conductivity, adhesivity, thermal conductance, suitable for adhesion and wiring parts on a circuit board for semiconductors, or the like. SOLUTION: The conductive adhesive mainly comprising (A) silver powder, (B) an epoxy resin, (C) a bisalkenyl substituted nadiimide and (D) a curing agent, and the silver powder (A) is included in an amount necessary for conductivity and the silver powder (a) having 3.5-8.0 g/ml of tap density and the silver powder (b) having 0.1-3.5 g/ml of tap density are separately compounded in specified amounts.
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