发明名称 POSITIVE PHOTORESIST COMPOSITION AND METHOD FOR FORMING THIN FILM RESIST PATTERN FOR OBLIQUE IMPLANTATION PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a positive photoresist composition capable of forming a high contrast thin film resist pattern, suppressing scumming and having good storage stability and heat resistance. SOLUTION: The positive photoresist composition comprises (A) a novolak resin containing >=20 mol% m-cresol repeating units and having 1-ethoxyethyl groups substituted for the hydrogen atoms of part of phenolic hydroxyl groups, (B) a quinonediazido-ester compound, e.g. of formula (1) and (C) 1,1-bis(4- hydroxyphenyl)cyclohexane.
申请公布号 JP2003149816(A) 申请公布日期 2003.05.21
申请号 JP20010352287 申请日期 2001.11.16
申请人 TOKYO OHKA KOGYO CO LTD 发明人 KATANO AKIRA;NAKAGAWA YUSUKE;KONO SHINICHI;DOI KOSUKE
分类号 G03F7/004;G03F7/022;G03F7/023;G03F7/039;G03F7/40;H01L21/027;H01L21/266 主分类号 G03F7/004
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