| 摘要 |
PROBLEM TO BE SOLVED: To provide a flame-retardant resin composition having high moisture- proofness and high resistance to soldering heat, and suitable for a printed wiring board and a semiconductor substrate, a resin varnish containing the composition, a flame-retardant prepreg containing the composition, a flame-retardant substrate obtained from the prepreg, and a flame-retardant laminate made by laminating a metal foil or metal sheet on the flame-retardant substrate to form an laminated material. SOLUTION: The resin composition is characterized in that it contains (A) a polymaleimide compound represented by general formula [1] (wherein R1 is an organic m-valent group; Xa and Xb may be the same or different and are each a monovalent atom or group selected from a hydrogen atom and an organic group; and m is an integer of 2 or greater), (B) an epoxy resin having two or more glycidyl groups in the molecule, (C) a phenolic resin having two or more OH groups in the molecule, (D) aluminum hydroxide, and (E) a tin compound.
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