发明名称 POLYOXYMETHYLENE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyoxymethylene resin composition having high thermal stability, good moldability and excellent in appearance with little foreign matters. SOLUTION: The polyoxymethylene resin composition contains 100 pts.wt. of a polyoxymethylene resin and 0.01-10 pts.wt. of an alkoxymethylguanamine represented by general formula (I) [wherein R is H, a 1-22C hydrocarbon group, a halo- or nitro-substituted hydrocarbon group, an aryl group, an aralkyl group, or a 3-10C cycloalkyl group; and R1 to R4 are each H or an alkoxymethyl group -CH2 OR' (wherein R' is a 1-8C alkyl group), provided that at least two of R1 to R4 comprise each an alkoxymethyl group].
申请公布号 JP2003147162(A) 申请公布日期 2003.05.21
申请号 JP20010348776 申请日期 2001.11.14
申请人 TORAY IND INC 发明人 TOGAWA MITSUNARI;NISHIMURA TORU;KARASAWA HIROO
分类号 C08L59/00;C08K5/3492;(IPC1-7):C08L59/00;C08K5/349 主分类号 C08L59/00
代理机构 代理人
主权项
地址