| 发明名称 |
POLISHING APPARATUS AND METHODS CONTROLLING THE POLISHING PRESSURE AS A FUNCTION OF THE OVERLAPPING AREA BETWEEN THE POLISHING HEAD AND THE SEMICONDUCTOR SUBSTRATE |
| 摘要 |
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| 申请公布号 |
EP1311368(A2) |
申请公布日期 |
2003.05.21 |
| 申请号 |
EP20010964364 |
申请日期 |
2001.08.22 |
| 申请人 |
LAM RESEARCH CORPORATION |
发明人 |
SALDANA, MIGUEL, A.;WILLIAMS, DAMON, VINCENT |
| 分类号 |
B24B41/04;B24B41/06;B24B49/16;B24B53/007;H01L21/304;H01L21/306;(IPC1-7):B24B37/00 |
主分类号 |
B24B41/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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