| 发明名称 |
Perimeter anchored thick film pad |
| 摘要 |
<p>A thick film circuit with a perimeter anchored thick film pad is provided. The thick film circuit includes a base substrate, a thick film bonding pad, and a solder mask layer. The thick film bonding pad is formed on the surface of the base substrate. The solder mask layer is also formed on the surface of the base substrate, and overlaps a portion of the thick film bonding pad in order to improve adhesion between the thick film bonding pad and the base substrate.</p> |
| 申请公布号 |
EP1313143(A2) |
申请公布日期 |
2003.05.21 |
| 申请号 |
EP20020025833 |
申请日期 |
2002.11.18 |
| 申请人 |
GENNUM CORPORATION |
发明人 |
VANDERMEULEN, MARK;ROY, DAVID |
| 分类号 |
H01L23/15;H01L23/498;H05K1/09;H05K3/34;(IPC1-7):H01L23/498;H01L23/538 |
主分类号 |
H01L23/15 |
| 代理机构 |
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代理人 |
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| 主权项 |
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