| 摘要 |
PROBLEM TO BE SOLVED: To provide a slice device and a slice method capable of efficiently cutting wafers of high quality by preventing a displacement of a wire in relation to an uneven work. SOLUTION: This slice device for cutting a traveling wire 4 by supplying the slurry 14 to the wire and pushing the wire to a silicon ingot 1 is provided with a position displacement sensor 21 for detecting a position displacement of the wire 4 and a slice condition correcting means 40 for detecting a position displacement of the wire and for correcting the slice condition when a position displacement is generated. |
