| 发明名称 |
Flip-chip semiconductor device having an improved reliability |
| 摘要 |
A BGA semiconductor device includes a package substrate carrying thereon a semiconductor chip in a face-down state and a cap member covering the semiconductor chip on the package substrate, wherein the cap member has a optimized Young modulus smaller than about 20 GPa and a thermal conductivity exceeding about 100 W/(m.K).
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| 申请公布号 |
US6566748(B1) |
申请公布日期 |
2003.05.20 |
| 申请号 |
US20000615728 |
申请日期 |
2000.07.13 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
SHIMIZU NOBUTAKA;IMAMURA KAZUYUKI;KIKUCHI ATSUSHI;MINAMIZAWA MASAHARU |
| 分类号 |
H01L23/10;H01L21/56;H01L23/04;H01L23/06;(IPC1-7):H01L23/12 |
主分类号 |
H01L23/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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