发明名称 Epitaxial silicon wafer, method for producing the same and subtrate for epitaxial silicon wafer
摘要 An epitaxial silicon wafer, which has no projections having a size of 100 nm or more and a height of 5 nm or more on an epitaxial layer, and a method for producing an epitaxial silicon wafer, wherein a single crystal ingot containing no I-region is grown when a silicon single crystal is grown by the CZ method, and an epitaxial layer is deposited on a silicon wafer sliced from the single crystal ingot and containing no I-region for the entire surface. An epitaxial wafer of high quality with no projection-like surface distortion observed as particles on an epi-layer surface is provided by forming a wafer having no I-region for the entire surface from a single crystal and depositing an epitaxial layer thereon, and a single crystal having no I-region for entire plane is produced with good yield and high productivity, thereby improving productivity of epi-wafers and realizing cost reduction.
申请公布号 US6565822(B1) 申请公布日期 2003.05.20
申请号 US20000646713 申请日期 2000.09.21
申请人 SHIN-ETSU HANDOTAI CO., LTD. 发明人 HOSHI RYOJI;SONOKAWA SUSUMU;SAKURADA MASAHIRO;OHTA TOMOHIKO;FUSEGAWA IZUMI
分类号 C30B29/06;C30B15/00;C30B15/20;(IPC1-7):C09B33/26 主分类号 C30B29/06
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