发明名称 |
Epitaxial silicon wafer, method for producing the same and subtrate for epitaxial silicon wafer |
摘要 |
An epitaxial silicon wafer, which has no projections having a size of 100 nm or more and a height of 5 nm or more on an epitaxial layer, and a method for producing an epitaxial silicon wafer, wherein a single crystal ingot containing no I-region is grown when a silicon single crystal is grown by the CZ method, and an epitaxial layer is deposited on a silicon wafer sliced from the single crystal ingot and containing no I-region for the entire surface. An epitaxial wafer of high quality with no projection-like surface distortion observed as particles on an epi-layer surface is provided by forming a wafer having no I-region for the entire surface from a single crystal and depositing an epitaxial layer thereon, and a single crystal having no I-region for entire plane is produced with good yield and high productivity, thereby improving productivity of epi-wafers and realizing cost reduction.
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申请公布号 |
US6565822(B1) |
申请公布日期 |
2003.05.20 |
申请号 |
US20000646713 |
申请日期 |
2000.09.21 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
HOSHI RYOJI;SONOKAWA SUSUMU;SAKURADA MASAHIRO;OHTA TOMOHIKO;FUSEGAWA IZUMI |
分类号 |
C30B29/06;C30B15/00;C30B15/20;(IPC1-7):C09B33/26 |
主分类号 |
C30B29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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