发明名称 |
Process for the removal of resist material |
摘要 |
The present invention provides a process for the peeling of a resist material with a pressure-sensitive adhesive sheet which involves the improvement in the removal of resist material or the enhancement of peelability of resist material to certainly remove the resist material from the object regardless of the properties or treated state of the resist material. The process comprises (1) after the application of the pressure-sensitive adhesive sheet, effecting a stress-imparting treatment which causes shrinkage or expansion of the pressure-sensitive adhesive sheet so that a stress develops at the interface between the resist material and the object or (2) prior to the application of the resist material to the object, effecting surface treatment to the object such that the surface of the object has a surface free energy of to not greater than 60 dyne/cm.
|
申请公布号 |
US6565704(B2) |
申请公布日期 |
2003.05.20 |
申请号 |
US20010833812 |
申请日期 |
2001.04.13 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
TOYODA EIJI;NAMIKAWA MAKOTO;OKEYUI TAKUJI |
分类号 |
B08B7/00;G03F7/42;(IPC1-7):B32B35/00 |
主分类号 |
B08B7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|