High temperature surface mount transducer

摘要

There is disclosed a high temperature surface mounted pressure transducer. The pressure transducer consists of three basic parts which include an ultra thin surface mount sensor positioned on a borosilicate glass structure having four or more circular depressions which correspond to the contact areas of the semiconductor sensor with additional depressed lead-out channels. The lead-out channels and the contact depressions are metalized with a high temperature metalization system. The composite structure consisting of the ultra thin surface mount sensor and borosilicate glass support structure is now mounted in a metallic flat-pack header or housing. In so mounting, the sensor is first mounted to the glass structure using a metal glass frit in the contact depressions and as Pyroceram glass in the non-protruding area of the sensor structure. The composite sensor metalized glass structure is then affixed to the metal structure, which is the metallic housing using an ultra high temperature solder such as indium gold or a low melting Pyroceram. The lead on the glass support plates are soldered to the leads on the flat-pack and the flat-pack can now be attached to any structure either by spot welding or by a suitable solder or other cement.