发明名称 |
Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor |
摘要 |
The present invention is a semiconductor sensor package for incorporating a semiconductor sensor chip. The main surface for mounting the semiconductor sensor chip is formed at a predetermined angle with respect to the surface of a printed circuit board for mounting the package. The main surface is provided with a plurality of terminals along two opposite sides for connecting with the input/output terminals of the semiconductor sensor chip and a bottom surface perpendicular to the main surface with a plurality of pins respectively formed along two sides parallel to the main surface. The plurality of pins are inserted into mounting holes formed in the printed circuit board, and the plurality of terminals provided along parallel sides the pins are electrically connected.
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申请公布号 |
US6564634(B2) |
申请公布日期 |
2003.05.20 |
申请号 |
US20010957242 |
申请日期 |
2001.09.21 |
申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
UEYANAGI KATSUMICHI;NISHIKAWA MUTSUO;SASAKI MITSUO |
分类号 |
G01P1/02;G01P9/04;G01P15/08;G01P15/11;G01P15/12;G01P21/00;H01F10/12;H05K1/18;(IPC1-7):G01P3/00 |
主分类号 |
G01P1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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