Semiconductor package and production method thereof

摘要

A semiconductor package and its production method in which the semiconductor package is produced by having via holes for electrically connecting top and bottom surface of a double-sided copper clad substrate and cutting the substrate at a line separating the via holes into half. The semiconductor package includes a plurality of wiring patterns on the double-sided copper clad substrate, via holes for interconnecting the top and bottom sides of the substrate and having a long hole shape so that the via hole is shared by adjacent semiconductor packages when the substrate is cut and separated, semiconductor chips mounted on predetermined positions on the substrate, and resin for sealing an entire body of the substrate.