发明名称 RESIN COMPOSITION FOR HIGH FILLING EXTRUSION MOLDING OF WOOD FLOUR AND ITS EXTRUSION MOLDED BODY
摘要 PROBLEM TO BE SOLVED: To provide an extrusion molding body having a specific wood tone in which wood flour is highly filled and capable of being satisfied even by a side of physical properties and to provide a resin composition for extrusion molding in order to obtain the extrusion molding body. SOLUTION: The resin composition for wood flour highly filling extrusion molding is provided by containing 30 wt.% or over of wood flour, 3-10 wt.% of a high fluid resin of 100-500 g/10 min in MFR, 12-65 wt.% of a thermosetting resin of 1-50 g/10 min in MFR and 2-10 wt.% of a slip agent as essential ingradients. A flour high filling extrusion molded body of a plane, special shape or hollow shape is obtained by extrusion-molding the resin composition. The extrusion molded body of the special shape is of a (plane) shape with a rib. The extrusion molded body excellent in a design property and a weather resistance is obtained by applying a pigmented coating after grinding at least one surface of the extrusion molded body.
申请公布号 JP2003145513(A) 申请公布日期 2003.05.20
申请号 JP20010342012 申请日期 2001.11.07
申请人 KURABO IND LTD 发明人 NISHIKAWA TAKAHIRO;TANAKA TADAKURO;AKANE NORIYUKI;TOMIJIMA MASAHIRO
分类号 B27N3/00;B27N5/00;B29C47/00;B29K101/12;B29K105/06;B29L7/00;B29L22/00;B29L24/00;C08J5/00;C08L97/02;C08L101/00;(IPC1-7):B27N3/00 主分类号 B27N3/00
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