发明名称 SUCTION PAD
摘要 <p>PROBLEM TO BE SOLVED: To prevent any deflection, troubles, or the like in a movable arm or the like to support a suction pad by reducing the weight of the suction pad to such and carry a plate-like article such as a semiconductor wafer. SOLUTION: In the suction pad 1 having at least a suction unit 7 to suck and hold the plate-like article and a frame 8 to surround the suction unit, the suction unit 7 and the frame 8 are formed of porous ceramic, and a shielding film 8a to prevent any air leakage is applied to the frame 8.</p>
申请公布号 JP2003145473(A) 申请公布日期 2003.05.20
申请号 JP20010347601 申请日期 2001.11.13
申请人 DISCO ABRASIVE SYST LTD 发明人 YAMANAKA SATOSHI;MURAKAMI TOMOTAKA
分类号 B25J15/06;B65G49/07;H01L21/677;H01L21/68;(IPC1-7):B25J15/06 主分类号 B25J15/06
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