| 发明名称 |
Method for mounting a semiconductor chip to a semiconductor chip-mounting board |
| 摘要 |
A strengthening land is formed on a semiconductor chip-mounting board correspondingly to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby to improve a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.
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| 申请公布号 |
US6566165(B1) |
申请公布日期 |
2003.05.20 |
| 申请号 |
US19990417307 |
申请日期 |
1999.10.13 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OTANI HIROYUKI;YAGI YOSHIHIKO;YAMAMOTO KENICHI |
| 分类号 |
H05K3/34;H01L21/44;H01L21/48;H01L21/50;H01L21/60;H01L23/498;H05K1/18;(IPC1-7):H01L21/44 |
主分类号 |
H05K3/34 |
| 代理机构 |
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