发明名称 |
Stacking multiple devices using direct soldering |
摘要 |
In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.
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申请公布号 |
US6566610(B1) |
申请公布日期 |
2003.05.20 |
申请号 |
US20010032908 |
申请日期 |
2001.11.01 |
申请人 |
VIRTIUM TECHNOLOGY, INC. |
发明人 |
NGUYEN CHINH;HOANG PHU;HOANG PHAN;LE ANDY |
分类号 |
H01L25/10;H05K1/14;H05K3/34;(IPC1-7):H05K1/16 |
主分类号 |
H01L25/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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