Ultrasonic bonding method

摘要

When connecting electrodes of a chip device CP are ultrasonic-bonded to circuit electrodes provided for a resin substrate 10 to mount the chip device CP on the resin substrate 10, a heater 5 for heating the resin substrate 10 is provided with which the temperature of the resin substrate 10 is raised to a level with which the ratio of elastic modulus epsih realized when heat is supplied with respect to elastic modulus epsir of the resin substrate 10 at room temperature satisfies 1>epsih/epsir>=0.5. The heater 5 may be provided for the substrate retaining frame 4.