| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad restricted in lowering of hardness and a change in the compression characteristic of a cushion layer, namely, restricted in a change in the characteristic of the whole of the polishing pad to prevent lowering of an yield of wafers due to changes in the polishing characteristic such as uniformity and polishing rate with the lapse of time and having the stabilized high polishing speed and a long service life. SOLUTION: This polishing pad has at least a polishing layer and the cushion layer, and a swelling ratio of the cushion layer in relation to water is set at 40% or less. |
