| 摘要 |
A polishing composition comprising:(a) colloidal silica having a positively charged surface,(b) colloidal silica having a negatively charged surface,(c) at least one acid selected from the group consisting of nitric acid, hydrochloric acid, sulfuric acid, lactic acid, acetic acid, oxalic acid, citric acid, malic acid, succinic acid, butyric acid and malonic acid,(d) at least one anticorrosive selected from the group consisting of benzotriazole, benzimidazole, triazole, imidazole, tolyltriazole and their derivatives, and(e) water. |
