| 摘要 |
The present invention discloses a method of manufacturing a dual chip package using tape wiring boards. According to the method, an upper tape wiring board, a lower tape wiring board, and a lead frame are prepared. Each of the tape wiring boards includes a polymeric tape having windows patterned therein, metal patterns formed on the lower surface of the polymeric tape at either sides of said windows. The metal patterns have pad connection portions exposed through the window. Lead connection portions extend outwardly from said polymeric tape. An adhesive layer is formed on the lower surface of the tape. A lower chip is attached to a lower surface of the die pad. The lower chip includes an active surface having a plurality of electrode pads at approximately the center and a rear surface attached to the lower surface of the die pad. An upper chip is attached to an upper surface of the die pad. The upper chip includes an active surface having a plurality of electrode pads at approximately the center and a rear surface attached to the upper surface of the die pad. Each of the adhesive layers of the upper tape wiring board and the lower tape wiring board is attached to a respective one of the active surfaces of the upper chip and the lower chip. The windows of the lower and upper tape wiring boards expose the electrode pads of the lower and upper chips, respectively. Each of the pad connection portions is attached to a respective one of the electrode pads. Each of the lead connection portions is attached to a respective one of the inner leads. Next, the upper chip, the lower chip, the upper wiring board, and the lower wiring board are encapsulated to form a package body.
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