发明名称 Efficient heat pumping from mobile platforms using on platform assembled heat pipe
摘要 A heat exchanger system for mobile platforms is provided. In one embodiment, a heat conductive block is coupled with an integrated circuit package. A first proximal end of a first section of heat conductive tube is coupled to the metal block, and a free end of the first section of heat conductive tube is configured to sealably couple with a second free end of a corresponding second portion of heat conductive tube. Additionally, a first portion of a wick is disposed within the first section of heat conductive tube.
申请公布号 US6564859(B2) 申请公布日期 2003.05.20
申请号 US20010893948 申请日期 2001.06.27
申请人 INTEL CORPORATION 发明人 REISFELD GIDEON
分类号 F28D15/04;H01L23/427;(IPC1-7):F28D15/00 主分类号 F28D15/04
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