| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounted substrate in which metal plates are densely arranged, the consumption of the metal plates is reduced and manufacturing cost is reduced. SOLUTION: Multiple chip mounted areas partitioned by a first periphery partitioning part, a first end edge where multiple first projected end edges and multiple first recessed end edges are formed, and a second end edge which faces the first end edge and is formed in parallel are arranged on the upper face of the mounted substrate. An adhesive injecting port becoming a path which extends from the end edge to the chip mounted area and guides injected adhesive to the chip mounted area, and a first positioning hole passing to a base from the upper face, are formed in the first projected end edge. The adjacent first projected end edges are partitioned through the first recessed end edge. Multiple second positioning holes passing from the upper face to the base are formed in the second end edge. |
