| 摘要 |
PROBLEM TO BE SOLVED: To simplify wiring work by reducing the number of wire bonding for the mounted member of a semiconductor light emitting device. SOLUTION: The semiconductor light emitting device 1 is provided with an element main body 2 and a sub-mount member 11. The element main body 2 is constituted so that respective semiconductor layers 4, 5 and 6 are formed on the surface of a transparent insulating substrate 3, and an N-side electrode 9 as well as a P-side electrode 10 are formed on predetermined places of respective layers. The sub-mount member 11 is provided with an auxiliary N-side electrode layer 15 formed so as to be insulated to the surface of a conductive substrate 12, and an auxiliary P-side electrode 14 formed so as to be conducted. The sub-mount member 11 and the element main body 2 are constituted integrally so that the surface side of the sub-mount member 11 is opposed to the surface side of the element main body 2 mutually, and the N-side electrode layer 15 is conducted while the auxiliary P-side electrode layer 14 is conducted to the P-side electrode 10. The semiconductor light emitting device 1, constituted in such a manner as described above, is mounted on the mounted member 16. |
