| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip component mounting method which makes it possible to easily solder an electrode part of a chip component to a land part at low cost and is easy to evade mounting defects. SOLUTION: A substrate provided with a wiring pattern 2 which has the land part 3 is prepared and after preliminary solder 4 is provided on at least the surface of the land 3 as a preliminary solder forming method, a resist layer 5 formed of thermosetting resin, etc., is applied onto the entire surface of the substrate as a resist layer forming process and dried and half-hardened. As a chip component press-bonding process, the chip component is pressed against the substrate 1 at a specified position from above the half-hardened resist layer 5 to press the electrode part 6a of the chip component 6 against the preliminary solder 4 on the land part 3. Then the substrate 1 is heated in a reflow furnace as a heating process and then while the preliminary solder 4 is fused to solder the electrode part 6a of the chip component 6 to the preliminary solder, the resist layer 5 is completely hardened to hold the chip component 6 on the substrate 1.</p> |
