发明名称 WIRING METHOD OF PLATED LEAD WIRE AND MULTILAYER BOARD
摘要 PROBLEM TO BE SOLVED: To provide the wiring method of a plated lead wire which can reduce manufacturing man-hour without the occurrence of a defective product where the plated lead wire remains in pieces after dicing and lead wires are shorted, and without the drop of the degree of freedom in design even if displacement occurs between an outer layer and an inner layer or displacement occurs in dicing when the plated lead wire is disposed between the pieces, and to provide an inexpensive multilayer board. SOLUTION: The plated lead wire is wired so that the positions of connection parts 63 where the plated lead wire 61 and the multiple parallel lead wires 62 connected to the adjacent pieces cross become alternately zigzag positions at every lead wire with a cut line as a reference. The planar shape of the plated lead wire is to be a rectangular wave shape, a saw-tooth wave shape and a wavy shape.
申请公布号 JP2003142625(A) 申请公布日期 2003.05.16
申请号 JP20010337804 申请日期 2001.11.02
申请人 NEC TOPPAN CIRCUIT SOLUTIONS INC 发明人 YASUKAWA TOSHIO;KAMATA MITSUAKI
分类号 H05K1/02;H01L23/12;H05K3/00;H05K3/46;(IPC1-7):H01L23/12 主分类号 H05K1/02
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