| 发明名称 |
METHOD FOR FORMING MULTILAYER WIRING |
| 摘要 |
PROBLEM TO BE SOLVED: To simply manufacture multilayer wiring structure provided with uniform hollow structure between wiring parts. SOLUTION: A sheet film (transfer material) 111 is prepared on which a photosensitive resin film 110 having photosensitivity and heat curing is formed, the surface of the resin film 110 is stuck to a substrate 101 on which a connection part 109 is formed, and the film 110 is formed so that the connection part 109 is embedded and a hollow part is formed between the wiring parts of a 1st wiring layer 108.
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| 申请公布号 |
JP2003142578(A) |
申请公布日期 |
2003.05.16 |
| 申请号 |
JP20010337719 |
申请日期 |
2001.11.02 |
| 申请人 |
NIPPON TELEGR & TELEPH CORP |
发明人 |
SATO NORIO;MACHIDA KATSUYUKI;KURAKI OKU |
| 分类号 |
H01L23/522;H01L21/306;H01L21/3205;H01L21/768;H01L23/52;(IPC1-7):H01L21/768;H01L21/320 |
主分类号 |
H01L23/522 |
| 代理机构 |
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