| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package in which the radiation property of a semiconductor chip is improved, which has electromagnetic wave shielding property, and in which the impedance characteristic of a signal line from the semiconductor chip to an outer electrode can easily be designed. SOLUTION: The package is provided with the semiconductor chip 2, a metal base body 1 where the semiconductor chip 2 is mounted on an upper face, ditch grooves 11 formed in a region from a position just below and near the semiconductor chip 2 to a peripheral edge on the lower face of the metal base body 1, through holes 12 passing through the metal base body 1 in a thickness direction at the inner ends of the ditch grooves 11, signal lines 3 in which recessed grooves and holes formed in insulating films 31 on the inner faces of the ditch grooves 11, and the through holes 12, are filled with conductors 32 and which is electrically connected to the semiconductor chip 2 in the inner end and a metal cap 4 arranged on the metal base body 1 so that it covers the semiconductor chip 2. The heat of the semiconductor chip 2 is radiated by the metal base body 1 and radiation property is improved. Since the signal line 3 is shielded by the metal base body 1, an impedance characteristic can easily be designed and electromagnetic shielding property is improved. |
