| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component wherein a failure due to the infiltration of sealing resin into a cavity in the component is prevented. SOLUTION: A device chip 1 having a specified functional part 8 and a substrate 3 made of a specified material are electrically and mechanically connected with each other by conductive bumps 2, so that a specified cavity 7 containing the functional part 8 is formed between the chip 1 and the substrate 3. External pheripheries of the chip 1 and the substrate 3 are sealed by resin 5 for shielding the part 8 to be from the outer atmosphere. In an electronic component 100 designed in this manner, a damming member 20 made of low melting point metal is installed between the chip 1 and the substrate 3 outside the part 8 and inside the location planned for the resin 5 for preventing the infiltration of the resin 5 prior to the sealing by the resin 5. |
