发明名称 RESIN COMPOSITION FOR ELECTRIC INSULATION, INSULATION MATERIAL FOR ELECTRONIC MATERIAL, AND THEIR MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a specific resin composition or the like for electric insulation excellent in thermal resistance, low thermal expansion property, insulation, and adhesion which, moreover, can produce a hybrid cured matter without fear of void, crack, or the like, and facilitate molding process in a semi-cured state. SOLUTION: The resin composition for electric insulation contains methoxy- group-containing silane-denatured novolac type epoxy resin obtained by demethanolic condensation reaction of oxyepoxy resin obtained by denaturation with ring opening of a part of epoxy group of novolac type epoxy resin (1) and methoxysilane partial condensation matter (2). Or, one containing methoxy- group-containing silane-denatured novolac type epoxy resin obtained by demethanolic condensation reaction of oxyepoxy resin obtained by denaturing a part of epoxy group of novolac type epoxy resin (1), a partial methoxysilane condensation product (2) and an epoxy compound having one hydroxy group in one molecule (3).
申请公布号 JP2003141933(A) 申请公布日期 2003.05.16
申请号 JP20020225269 申请日期 2002.08.01
申请人 ARAKAWA CHEM IND CO LTD 发明人 TAKEUCHI TAKESHI;AIDA HIDEKI;TONO TETSUJI
分类号 C08J5/24;C08G59/14;C08G59/40;C08L63/00;H01B3/40;(IPC1-7):H01B3/40 主分类号 C08J5/24
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