| 摘要 |
PROBLEM TO BE SOLVED: To provide a coil-cooling structure of a semiconductor-manufacturing apparatus that can reduce a sectional area at an electromagnetic coil section, and to provide the semiconductor-manufacturing apparatus. SOLUTION: A magnetism-generating apparatus 6 comprises a main electromagnetic coil section 7 that forms a magnetic field nearly parallel to the upper surface of a support rest, and an auxiliary electromagnetic coil section 8 that is arranged on nearly the same axis as each main electromagnetic coil section 7 and forms a magnetic field opposite to that formed by the main electromagnetic coil section 7. Electromagnetic coils 12 at the electromagnetic coil sections 7 and 8 are accommodated in a coil accommodation member 13 made of a material having thermal conductivity. The coil accommodation member comprises a first plate 14 and a plurality of second plates 15 extended in parallel from one surface of the first plate 14. A cooling pipe 16 for supplying cooling water is joined to a surface at the side of the first plate 14 opposite to the side of the second plate 15. The electromagnetic coil 12 is cooled by the cooling water flowing in the cooling pipe 16. |
