发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To solve such a problem that, when linear laser light is emitted overlapped to a semiconductor film, a fringe is produced thereon and they affect the characteristic of the semiconductor film. SOLUTION: After first condition laser light is emitted to an amorphous semiconductor film in an atmosphere containing oxygen to crystallize it, an oxide film that is formed in a first condition laser light emission step is removed and a laser light irradiation device of 15 J or larger in output energy is used in an inert gas or a vacuum atmosphere to emit second condition planary laser light where the energy distribution of a laser light irradiation part is±3% or less and an irradiation area is 30 cm<2> or larger, thereby improving the flatness of the surface of a crystalline semiconductor film.</p>
申请公布号 JP2003142402(A) 申请公布日期 2003.05.16
申请号 JP20020232576 申请日期 2002.08.09
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 SHIGA AIKO;MIYAIRI HIDEKAZU;TANAKA KOICHIRO
分类号 G02F1/1368;H01L21/20;H01L21/268;H01L21/336;H01L29/786;(IPC1-7):H01L21/20;G02F1/136 主分类号 G02F1/1368
代理机构 代理人
主权项
地址