发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To solve such a problem that, when linear laser light is emitted overlapped to a semiconductor film, a fringe is produced thereon and they affect the characteristic of the semiconductor film. SOLUTION: After first condition laser light is emitted to an amorphous semiconductor film in an atmosphere containing oxygen to crystallize it, an oxide film that is formed in a first condition laser light emission step is removed and a laser light irradiation device of 15 J or larger in output energy is used in an inert gas or a vacuum atmosphere to emit second condition planary laser light where the energy distribution of a laser light irradiation part is±3% or less and an irradiation area is 30 cm<2> or larger, thereby improving the flatness of the surface of a crystalline semiconductor film.</p> |
申请公布号 |
JP2003142402(A) |
申请公布日期 |
2003.05.16 |
申请号 |
JP20020232576 |
申请日期 |
2002.08.09 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
SHIGA AIKO;MIYAIRI HIDEKAZU;TANAKA KOICHIRO |
分类号 |
G02F1/1368;H01L21/20;H01L21/268;H01L21/336;H01L29/786;(IPC1-7):H01L21/20;G02F1/136 |
主分类号 |
G02F1/1368 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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