METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technique by which the defective external form of a collectively molded package can be prevented and the product cost of a semiconductor device can be reduced. SOLUTION: A film is formed in the cavity 3 of a first metal mold 2 by providing film sucking pieces 4 on the bottom of the cavity 3 and forcibly sucking the film through film sucking gaps 5 partially provided around the pieces 4.