| 摘要 |
PROBLEM TO BE SOLVED: To enhance the yield by correcting the warp of a large-sized board in an electronic circuit unit in which multiple chip components are mounted on the large-sized board, then the board is sub-divided to provide multiple boards. SOLUTION: The method for manufacturing the electronic circuit unit comprises the steps of forming multiple sets of conductive patterns each having a wiring pattern 2 and a solder land 2a on a component mounting area S of the large-sized board 1A, and forming dummy spaces 6 in which chip components 3 are not mounted at a plurality of positions in the area S. The method further comprises the steps of conveying the board 1A onto the base board 4 of a mounting unit, holding the peripheral edge from the side by a slide clamp 5 and positioning the edge, pressing the space 6 from above by a pressing pin 7 to correct the warp of the board 1A, mounting the multiple components 3 on corresponding solder lands 2a in the correcting state, then conveying the board 1 to a reflowing furnace, melting the cram solder coating the land 2a, thereafter sub-dividing the board 1, and thereby providing multiple electronic circuit units in which the components 3 are mounted on the individual boards 1. |
