SEMICONDUCTOR MANUFACTURING APPARATUS FOR TAPE REMOVING PROCESS AND THE UNIT PROCESS

摘要

PURPOSE: A semiconductor manufacturing apparatus for tape removing process and the unit process are provided to easily remove a tape and to reduce the damage of a semiconductor substrate by using an adsorption member. CONSTITUTION: A tape removing apparatus is provided with a substrate pedestal(30) for loading a semiconductor substrate(100) attached with a tape(300) and a tape removing assembly. The tape removing assembly further comprises an adsorption member(21) installed near by the substrate pedestal(30) for removing the tape(300) of the semiconductor substrate(100) using a suction hole, and a driving member connected to the adsorption member(21) for horizontally shifting the adsorption member(21). The adsorption member(21) further includes an adsorbing part(213) and a gas jetting part(211) for jetting inert gas.