发明名称 LEAD-FREE CREAM SOLDER
摘要 PURPOSE: A flux in which wax having high softening point is contained as an additive so that reliability of electronic components is not deteriorated even in the soldering process of high temperature, and a cream solder comprising the flux are provided. CONSTITUTION: In a cream solder comprising solder alloy in the powder state or flux in the paste state, the cream solder is characterized in that the flux comprises wax having high temperature softening point as an additive, wherein the wax having high temperature softening point is one material or a mixture of two or more materials selected from the group consisting of polyethylene wax L-C 121N having softening point of 109 deg.C, amide wax LEBAX-140P having softening point of 144 deg.C, hydroxy bis amide wax L-C 701S having softening point of 145 deg.C, polypropylene wax L-C 503NC having softening point of 148 deg.C, polypropylene wax L-C 502N having softening point of 160 deg.C, polypropylene wax L-C 502NC having softening point of 151 deg.C, and polypropylene wax L-C 525N having softening point of 162 deg.C.
申请公布号 KR20030038144(A) 申请公布日期 2003.05.16
申请号 KR20010069571 申请日期 2001.11.08
申请人 ECOJOIN 发明人 KIM, DONG SIK;KO, MYEONG WAN;NA, TAE YEOP;SUN, JU HYEON
分类号 B23K35/22;(IPC1-7):B23K35/22 主分类号 B23K35/22
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