| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized cooling device suitable for cooling an electronic member or the like. SOLUTION: A thin film 11 of a metal B such as platinum or the like is formed on a silicon substrate 10. The terminals of a thin film 14 of a first metal A such as Au or the like which belongs to a kind different from the thin film 11 of the metal B, and the thin film 15 of a second metal A, are connected to the terminal of the thin film 11 through a first semiconductor thin film 12 and a second semiconductor thin film 13. When a current is conducted to flow from the thin film 15 of the second metal A at one side to the other side of the thin film 14 of the first metal A through the thin film 11 of the metal B, cooling effect is generated in the connecting part of the thin film 11 of the metal B and the thin film 14 of the first metal A. Therefore, an electronics element 16 to be cooled is arranged at the connecting part as shown in a figure 2 (b). The cooling device can be used not only for the cooling of the laser semiconductor element but also for the cooling of a microreactor or the like in the field of a biochemical reaction. |
