METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by which resin encapsulation can be performed highly reliably without causing such a failure as an exposed die pad, resin-unfilled portion, etc. SOLUTION: A semiconductor chip 12 bonded to the surface of the die pad 10 of a lead frame 8 is arranged in a cavity formed of top and bottom forces 4U and 4D respectively provided with upper and lower pins 14U and 14D. Then a resin is injected into the cavity in a state where the upper and lower pins 14U and 14D hold the chip 12 and pad 10 between them. When the injected resin becomes a prescribed state, the pins 14U and 14D are retreated into the forces 4U and 4D. The pins 14U and 14D are respectively provided with pressure sensors 16U and 16D which detect pressures applied to the front ends of the pins 14U and 14D so as to monitor the held states of the semiconductor chip 12 and die pad 10 between the pins 14U and 14D.