END POINT DETECTOR IN SEMICONDUCTOR FABRICATION EQUIPMENT AND METHOD THEREFORE

摘要

PURPOSE: An end point detector in semiconductor fabrication equipment and method therefore are provided to obtain the real-time detection of the etching termination time point and to improve the sensitivity of the detection by using a plurality of optical wavelength. CONSTITUTION: Plasma light beam generated in a chamber(100) is divided into a plurality of optical signals having a different wavelength by using an optical device(220). A photoelectric conversion device(230) is used for transforming the optical signals to electric signals corresponding to the intensity of the optical signal, wherein the photoelectric conversion device(230) is provided with a plurality of unit conversion devices having a peculiar address, respectively. An A/D converter(240) is used for transforming the electric signals to luminous intensity data as digital data. A signal operation unit(300) is used for supplying accumulated luminous intensity data to a control system(400) in real time. Then, an etching termination time point of a plasma etching equipment is controlled by the control system(400) using the accumulated luminous intensity data.