| 摘要 |
PURPOSE: A semiconductor power module and a manufacturing method thereof are provided to reduce the occupancy area of the module and to simplify manufacturing processes by integrating a power circuit chip and a control circuit chip in a single package. CONSTITUTION: A semiconductor power module(300) is provided with a control circuit part(310), a power circuit part(320), a case(330), and a cover(340). At this time, the control and power circuit part(310,320) are completely encapsulated by using the case(330) and the cover(340). At this time, the control circuit part(310) is located and spaced apart from the upper portion of the power circuit part(320), thereby reducing the occupancy area of the module. The control and power circuit part(310,320) are connected with each other, or a plurality of external terminals(350) using usual wires(314,324,325), so that other connection parts are unnecessary. |
