ADHESION EVALUATING METHOD FOR UV-SETTING RESIST INK, COPPER PLATE FOR COATING UV-SETTING RESIST INK, AND APPLICATION THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a method for evaluating adhesiveness of UV-setting resist ink to a copper plate, and to provide a copper plate and a circuit board manufacturing joint-body which have appropriate adhesiveness to the UV-setting resist ink. SOLUTION: In this method, a dye absorbent whose blue level changes according to presence ratio of -OH base is applied on the surface of copper plate, and the adhesiveness of resist ink is evaluated based on the blue level. Related to the copper plate for UV-setting resist ink application, the area percentage of a part in which B value changes to 51 or above is at least 90% when the dye absorbent comprising methylene blue 5 mass% solution is applied on the copper plate surface, and the hue of blue level is displayed in RGB, decimal number (0-255). The copper plate and a ceramics board constitute a joint body for manufacturing a circuit board. The ceramics board is jointed to an oxygen- free copper plate under a prescribed condition to manufacture the joint body.