发明名称 SUBSTRATE HOLDER
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate holder comprising a rubber sheet of good thermal conduction and a jig for cooling a substrate efficiently and from which the substrate is taken out with no risk of damage. SOLUTION: The substrate holder comprises a jig 1 made of such a material as a metal plate and having through holes 11 where a cooling water conducting part 90 is formed of a substrate holder base 91, a tubular ring 92 and an upper cover 93, the substrate holder base 91 is provided with a cooling water supply hole 911 and a cooling water discharge hole 912 communicating with the cooling water conducting part 90, substrate containing recesses 931 each having an annular step 930 are formed at a plurality of positions on the upper surface of the upper cover 93, and a vacuum pump connecting part 932 is formed to communicate with the substrate containing recess 931, and a flexible rubber sheet 2 having hollow suction protrusions 4 formed on the surface and an air introduction hole 3. The rubber sheet 2 and the jig 1 are bonded integrally and mounted on the annular step 930 of the substrate containing the recesses 931 through the rubber sheet 2.</p>
申请公布号 JP2003142565(A) 申请公布日期 2003.05.16
申请号 JP20010334581 申请日期 2001.10.31
申请人 JAPAN AVIATION ELECTRONICS INDUSTRY LTD 发明人 KOYAIZU TAKASHI
分类号 H01L21/302;H01L21/3065;H01L21/68;H01L21/683;(IPC1-7):H01L21/68;H01L21/306 主分类号 H01L21/302
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