| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket that is capable of applying a certain amount of pressure on the semi-conductor. SOLUTION: A pressure head 33, which is fitted to the poise 29 turning on the shaft 25 as a fulcrum, is arranged at the upper position of the package housing section 21. A cover fixing member 37 and a ball contact board 39 are arranged on the other side of the shaft 25 interposing the package housing section 21. The ball contact board 39, when arranged in the position shown in the solid line, support the ball member 35 provided on the poise 29 by the upper stage part 39a so that the top end of the pressure head 33 may be arranged with an interval from the semiconductor device housed in the package housing section 21, and, when slided to the position shown in the two-dot chain line, supports the ball member 35 of the poise 29 by from the upper stage part 39a to a slope 39b in order, and gradually lowers the poise 29 and the pressure head 33.
|
